X-ray
The 2 articles in the technical library tagged "X-ray", newest first.
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PCBA failure analysis: the evidence chain from symptom to root cause
The value of failure analysis is not in finding the crack but in delivering a reproducible evidence chain: from confirming the symptom to the root cause conclusion, every step has to be recorded.
X-ray and cross-section analysis of BGA solder joint cracks
A cracked solder joint is usually invisible to the eye. X-ray shows the shape; only a cross-section reveals the internal interface. The two methods together locate the actual failure interface.
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