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PCBA failure analysis: the evidence chain from symptom to root cause

Key takeaways

A standard failure analysis runs six steps: symptom confirmation -> visual inspection -> non-destructive testing (X-ray / ultrasound) -> electrical re-measurement -> destructive analysis (cross-section / dye-and-pry / SEM) -> root-cause report. The evidence chain requires a record at every step and reproducible conclusions; comparing the failed unit against good units from the same lot shortens localisation considerably.

When a failed unit reaches the laboratory, the usual request is "tell me what broke". Failure analysis is worth more than that — it has to answer why it broke and how to stop it happening again. That takes a complete evidence chain.

1. The standard six-step path

  • Confirm the symptom: the failure mode, the conditions under which it occurs, the proportion, the timing — the more specific the input, the shorter the path
  • Visual inspection: photograph and record burning, cracks, contamination and discolouration — see what can be seen without damage first
  • Non-destructive testing: X-ray for solder joints and internal defects, ultrasound for delamination and voids
  • Electrical re-test: reproduce, or partly reproduce, the failure under known conditions and pin down the failure point
  • Destructive analysis: cross-section, dye penetrant, SEM/EDS to examine the interface, plating and metallurgical layer
  • Root cause report: failure mode plus mechanism plus evidence plus improvement recommendations

2. Why the order cannot be shuffled

Skipping straight to a cross-section destroys the scene: a cross-section gives you one plane, whereas the clues — crack direction, contamination distribution — are usually lost in the process of cutting. Every step is potentially the crime scene for the next one, and that is exactly what the evidence chain means.

3. What to bring when submitting samples

Keep the failed unit in its original state (do not dismantle, abrade or wash it), include known-good units from the same batch for comparison, describe the symptom (when, under what conditions, in what proportion) and list what has already been checked. Analysis with a reference unit is usually far more efficient — without a baseline there is no such thing as an "anomaly".

4. How the report gets used

A competent root cause report feeds straight into an 8D: problem description, root cause, corrective action and verification method all line up. A report that says only "solder joint cracked", by contrast, moves improvement nowhere.

Turnaround time is arranged according to the actual project. You are welcome to state your target date when submitting samples; we will check it against the current schedule, confirm a feasible plan with you, and update you at each milestone.

Related Q&A

Related questions

Frequently asked questions on the same topic. The first paragraph of each answer is the conclusion.

What is the usual failure analysis workflow?

The standard path: phenomenon confirmation → external inspection → non-destructive testing (X-ray, ultrasonic) → electrical retest → destructive analysis (cross-section, dye-and-pry, SEM/EDS) → root-cause conclusion with an evidence-chain report. Every step is documented and the conclusion must be reproducible. A failed unit paired with a known-good reference dramatically speeds up localization.

What should I provide for failure analysis?

The failed unit itself (kept in original state—do not disassemble or grind it yourself), a known-good unit from the same batch as reference, a description of the failure (when, under what conditions, at what rate), and any preliminary checks already done. The more complete the information, the shorter the analysis path.

Can an already-disassembled failed unit still be analyzed?

Yes, but the analyzable scope narrows. Once the original fracture surface, burn marks, plating and interfaces are disturbed, many failure mechanisms can no longer be determined, and the result degenerates to "no anomaly found".

The first move on receiving a failed unit is to leave it alone: no disassembly, no grinding, no cleaning, no high current. Photograph the appearance and mounting position first, then send it in.

These answers share the same data source as the FAQ page.

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