Failure Analysis
The 3 articles in the technical library tagged "Failure Analysis", newest first.
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Partial Discharge on High-Voltage Harnesses - Why It Is Measured After Environmental Stress, and What Each Inspection Method Can Prove
Partial discharge can prove a defect exists but not where it is; X-ray can locate it but not explain it; cross-sectioning explains it but consumes the sample. The sequence, the way readings are interpreted and how the report is written decide whether the data can be reviewed at all.
PCBA failure analysis: the evidence chain from symptom to root cause
The value of failure analysis is not in finding the crack but in delivering a reproducible evidence chain: from confirming the symptom to the root cause conclusion, every step has to be recorded.
X-ray and cross-section analysis of BGA solder joint cracks
A cracked solder joint is usually invisible to the eye. X-ray shows the shape; only a cross-section reveals the internal interface. The two methods together locate the actual failure interface.
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