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AEC-Q100 / Q101 — Automotive-grade Components and PCB Reliability

AEC-Q100 covers automotive-grade integrated circuits and AEC…

Scope: Automotive chips and circuit boards

Standard No. AEC-Q100 / Q101
Scope Automotive chips and circuit boards
Capability CMA & CNAS accredited laboratory
Scheduling Scheduled per project

AEC-Q100 covers automotive-grade integrated circuits and AEC-Q101 automotive-grade discrete semiconductors. They specify accelerated life test methods at component level and are the basis of automotive-grade component qualification.

Standard positioning

AEC-Q and ISO 16750 sit at different levels: ISO 16750 verifies whether electrical and electronic equipment works in a vehicle, while AEC-Q verifies whether the component itself can withstand the automotive environment. OEMs usually require suppliers to provide AEC-Q qualified components.

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AEC-Q100 / Q101 applications

Scope

  • AEC-Q100: integrated circuits (MCU, logic, memory, analogue).
  • AEC-Q101: discrete semiconductors (diodes, transistors, MOSFETs, IGBTs).
  • AEC-Q200: passive components (resistors, capacitors, inductors).
  • Applies to: component manufacturers, and OEMs who need to verify that the components they select meet automotive requirements.

Structure and content

Main AEC-Q100 test items

  • Accelerated life: high-temperature operating life (HTOL), temperature cycling (TC), power cycling (PC).
  • Environmental stress: damp heat (THB/THU), HAST, high temperature and humidity with bias.
  • Mechanical stress: board-level stress, drop, lead strength.
  • Electrical stress: ESD withstand (CDM/HBM), latch-up, soft error.

Main AEC-Q101 test items

  • Similar to Q100, adjusted for the package and lead characteristics of discrete devices.
  • Includes power cycling, thermal resistance measurement, reverse voltage and gate stress.

Acceptance

  • Acceptance follows the AEC-Q failure criteria — zero failures to pass.
  • Sample size depends on production volume; a failure requires expanded sampling.

Common non-conformities

  • Substituting non-automotive-grade components — the most common reason for rejection in an OEM audit.
  • Solder joint cracking during temperature cycling (thermal expansion mismatch between package and PCB).
  • Insulation breakdown or package delamination after damp heat.
  • Insufficient ESD withstand level — not selected to the CDM class required.

Relationship to other standards

Level relative to ISO 16750

AEC-Q is component level and ISO 16750 is equipment level; they complement rather than replace each other.

With PCB

PCB reliability follows IPC-6012DA / AEC-Q material requirements and is used alongside this standard.

Use in real projects

OEMs generally do not repeat AEC-Q testing; they require suppliers to provide the component's AEC-Q qualification report. The laboratory can carry out component-level verification and selection assessment.

Service notes

The laboratory holds both CMA and CNAS accreditations, with approximately 10,000 m² of space and 500+ instruments. All testing is completed in our own laboratories — no subcontracting. On-site visits and witnessed testing are supported.

Testing is scheduled per project. When submitting samples, tell us your expected timeline; we will confirm a feasible plan against current availability and keep you updated at each milestone.

Test Matrix

Test items and typical conditions

AEC-Q is component-level automotive qualification: it tests the robustness of the device itself and does not replace component-level ISO 16750 validation. OEMs normally require both — devices through AEC-Q, assemblies through environmental reliability.

Device category Applicable standard Main test categories Focus
Integrated circuits AEC-Q100 Accelerated environmental stress (preconditioning, temperature-humidity bias, temperature cycling, power cycling, high-temperature storage), accelerated lifetime, package integrity Device-level failure rate and lot consistency
Discrete semiconductors AEC-Q101 High-temperature reverse bias, temperature cycling, intermittent operational life, solderability Junction temperature and package reliability
Passive components AEC-Q200 High-temperature storage, temperature cycling, humidity, mechanical shock and vibration, solderability Material and termination reliability
Optoelectronic devices AEC-Q102 High-temperature operating life, temperature-humidity bias, temperature cycling Lumen depreciation and packaging
Multi-chip modules AEC-Q104 Combined module-level stress Overall module reliability

Conditions and limits above are typical ranges for reference. The actual test levels, sample quantity and acceptance criteria follow the mutually confirmed test plan and standard version. Source: the clauses of each referenced standard.

Have a testing requirement? Send us your product details

Tell us the product model and test requirements. Our engineers will map out the test plan, the applicable standards and the item combination, and provide a quotation reference. The more specific the request, the sharper the answer.

  • Free scoping of the test plan and standards
  • Pre-scan testing during R&D to cut rework cost
  • On-site visits and witnessed testing supported
  • Scheduling per project, with progress updates at each milestone

Received — we will contact you shortly and follow up with a test plan and quotation.

By submitting you agree to be contacted by phone or email. Scheduling follows the project’s actual availability and is subject to mutual confirmation.

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